Professor  Sung Kyu Lim

Sung Kyu Lim received the B.S., M.S., and Ph.D. degrees from the University of California at Los Angeles in 1994, 1997, and 2000, respectively. He joined the School of Electrical and Computer Engineering, Georgia Institute of Technology in 2001, where he is currently Motorola Solutions Foundation Chair Professor. His current research interests include modeling, architecture, and electronic design automation (EDA) for heterogeneous 2.5D and 3D ICs. His research on 3D IC reliability is featured as Research Highlight in the Communication of the ACM in 2014. 

Dr. Lim is a recipient of the National Science Foundation Faculty Early Career Development (CAREER) Award in 2006. He received the Best Paper Awards from several EDA venues. He served as an Associate Editor of the IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD). He received the Class of 1940 Course Survey Teaching Effectiveness Award from Georgia Institute of Technology (2016, 2018, 2019, 2020).

• The Need for Fine-Pitch 3D IC Die Bonding Technology: Power Performance Benefits Perspective
  Some of the most popular technologies being actively adopted by the semiconductor industry for 3D heterogenous integration are micro-bumping and hybrid bonding. In this talk, we quantify and...