Reliability and Challenges in 3D NAND Flash memory
Speaker: Chun Jason Xue – Kowloon, Hong KongTopic(s): Hardware, Power and Energy
Abstract
3D NAND flash memory is a key technology for many modern electronic devices, and it is likely to continue to be an important part of the storage landscape in the future. In this lecture, we will introduce research in 3D NAND that focuses on reliability and performance challenges, including the intrinsic reliability flaws introduced in the manufacturing process, and the multi-bit-per-cell high-density challenges. Emerging new flash applications including computational SSD and SSD in automotive will also be introduced..
About this Lecture
Number of Slides: 58Duration: 60 minutes
Languages Available: Chinese (Traditional), English
Last Updated:
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